**Nvidia Abandons SOCAMM 1 After Technical Setbacks, Shifts Focus to SOCAMM 2**
Nvidia has scrapped its initial effort to commercialize SOCAMM 1 following repeated technical failures to meet expectations. The first-generation SOCAMM was intended as a low-power, high-capacity memory solution for AI servers but was hampered by delays and design challenges that prevented it from gaining market traction.
An industry insider revealed to ET News (original Korean report) that “Nvidia originally planned to introduce SOCAMM 1 within the year, but technical issues halted the project twice, preventing any actual large-scale orders.” As a result, Nvidia has now shifted its full attention to SOCAMM 2, the second-generation design promising significant improvements.
### Performance and Design Evolution with SOCAMM 2
SOCAMM 2 retains the detachable module form factor and 694 I/O ports of its predecessor but boosts transfer speeds from 8,533 MT/s to 9,600 MT/s. This enhancement translates into a system bandwidth increase from approximately 14.3 TB/s to around 16 TB/s on platforms such as the Blackwell Ultra GB300 NVL72, which is already prominent in discussions around leading GPUs for data centers.
Despite these advances, SOCAMM 2 continues to rely on LPDDR5X memory technology for the time being. However, ongoing discussions about adopting LPDDR6 indicate that the format is being developed with scalability and future upgrades in mind.
Importantly, the SOCAMM 2 module still claims to consume less power compared to traditional DRAM-based RDIMM solutions—a critical factor for energy-sensitive server environments. That said, these power savings await independent validation under real-world server workloads.
### Expanded Manufacturing Base and Industry Standardization
Whereas SOCAMM 1’s production was limited solely to Micron—raising concerns about supply stability—SOCAMM 2 benefits from broader industry support. Samsung Electronics and SK Hynix are working alongside Micron to prepare samples, potentially improving production stability and encouraging more competitive pricing.
Samsung and SK Hynix have indicated plans to prepare for SOCAMM mass production in the third quarter. However, industry analysts estimate that widespread availability of SOCAMM 2 modules is unlikely before early next year.
Another key distinction is the approach to standardization. SOCAMM 1 was developed outside of JEDEC, the global memory standards body, restricting its use primarily to Nvidia platforms. In contrast, SOCAMM 2 could involve JEDEC participation, increasing its accessibility and adoption potential across a broader range of systems.
If SOCAMM 2 achieves JEDEC standard status, it may evolve into a new industry format, providing a compact, high-bandwidth memory solution that extends beyond Nvidia’s ecosystem. Such a development holds particular relevance for creative professionals, as enhanced memory performance can directly improve tasks like video editing and handling of high-resolution footage.
### Looking Ahead: Opportunities and Challenges
While SOCAMM 2 shows promise, analysts urge caution. The evolving landscape—with LPDDR6 development accelerating—may impact SOCAMM 2’s long-term influence. As AI semiconductors deliver greater computational power, the pressure on memory systems to resolve data bottlenecks continues to grow.
Whether SOCAMM 2 will emerge as the definitive solution or simply one of several options in a crowded market will depend heavily on its execution, broader standardization efforts, and the pace at which LPDDR6 technologies reach maturity.
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